Thermal-Stress Coupling Optimization for Coaxial through Silicon Via

In this paper, a thermal-stress coupling optimization strategy for coaxial through silicon via (TSV) is developed based on the finite element method (FEM), artificial neural network (ANN) model and particle swarm (PSO) algorithm. order to analyze effect of design parameters distribution TSV, FEM simulations TSV are conducted by COMSOL Multiphysics. The structure symmetric. mapping relationships between performance indexes described ANN models simulation data FEM. addition, multi-objective function formulated desired indexes, then optimized modified PSO Based parameters, effectiveness validated simulations. simulated agree well with ones, which implies that can be control distribution. Therefore, achieve management improve its reliability.